COB Chip on Board
Pixon offers 10um precision Chip on Board manufacturing technology and 15 years of experience to implement the function of compact sensor board and electronic devices.
Our factory is located in New Taipei city, Taiwan. We have vertical integration
capability and skillful Taiwanese operators and professional R&D team.
We offer customize service and “Made in Taiwan“ stable quality and delivery.
COP Capability
- Handling PCB size (L*W*H) : 310mm*65mm* 2.0mm
- Bonding accuracy : +/-10um
- *Pixel to pixel ( 600 D.P.I. ) : <90um ( refer to drawing )
- Wafer size supported : 3~8 inches
- Chip tray supported : 6/8 inches.
- Chip size supported : 0.2~18mm
- Wire size supported : 23~38um
- Wire loop height :150~300um
- Wire loop length : 0.5~3.0mm
- Recognition size : less than 0.5*0.5 mm
- *Linear chip bonding(Inter chip gap), not single chip bonding
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